On July 25, 2025, Shenzhen - With the rapid development of technologies such as 5G communication, artificial intelligence, and the Internet of Things, electronic components are evolving towards high density, miniaturization, and high frequency, placing higher demands on the heat resistance, insulation, and signal transmission performance of packaging materials.
Organic silicon materials are becoming the mainstream choice in the field of electronic packaging due to their low dielectric constant, high thermal conductivity, and flexibility. The market size of organic silicon for electronic packaging in China is expected to reach 12 billion yuan in 2024, and is expected to exceed 14 billion yuan by 2025.
5G base station: explosive demand for high thermal conductivity silicone
The power of 5G base stations has increased by three times compared to 4G, and the heat generation has significantly increased. The "boron nitride filled silicone gel" developed by a certain enterprise has a thermal conductivity of 15W/m · K, which can quickly transfer the heat of AAU (active antenna unit) to the heat sink, reducing the equipment temperature by 15 ℃. At present, this product has been applied to 70% of 5G base station construction in China.
AI chips: Low stress packaging materials are key
The size of the AI training chip reaches 800mm ², and during the packaging process, it is prone to warping and cracking due to stress concentration. A new type of "additive liquid silicone rubber" reduces its elastic modulus from 1MPa to 0.3MPa by introducing flexible chain segments, which can absorb 80% of the packaging stress. The material has passed the AI chip packaging certification of a leading enterprise, with a 12% increase in yield rate.
Flexible display: stretchable silicone substrate breakthrough
Folding screen phones require substrate materials that are both flexible and resistant to bending. The "siloxane polyurethane copolymer" developed by a certain laboratory can be stretched up to 200% without breaking, and the resistance change rate after 100000 bends is less than 5%. This material has been used for testing the prototype of the next generation foldable screen mobile phone of a certain brand.
Technical bottleneck: High frequency losses need to be further reduced
In the millimeter wave frequency band (above 24GHz), traditional organic silicon materials have a dielectric loss of 0.01 and severe signal attenuation. A certain enterprise reduced the dielectric loss to 0.003 while maintaining material flexibility by introducing fluorinated siloxane monomer. At present, the technology has entered the pilot stage and is expected to be mass-produced in 2026.
