[City, Date] Recently, Hubei Jusheng Technology announced that its independently developed "high-temperature weather resistant ethyl silicone oil release agent" has passed the rigorous testing of SMIC and has been successfully applied to the 12 inch wafer packaging process, filling the gap in semiconductor specific release materials in China. This technology can significantly improve chip yield, reduce production costs, and provide key support for the independent and controllable semiconductor industry chain in China.


Technical breakthrough: solving the problem of demolding at 350 ℃ high temperature
In the semiconductor packaging process, epoxy resin molding compound (EMC) needs to be rapidly cured and formed at a high temperature of 350 ℃. Traditional release agents have insufficient temperature resistance (usually<250 ℃), which can easily lead to mold adhesion, product burrs, and other problems, directly affecting chip yield. Hubei Jusheng Technology spent 3 years researching and developing, and through molecular structure design, introduced aromatic branches into the main chain of ethyl silicone oil, raising its thermal decomposition temperature to 400 ℃ and reducing its surface tension to 19 mN/m (traditional product 25 mN/m), achieving a dual breakthrough of "no decomposition at high temperature and easy demolding at low temperature".


Our mold release agent can produce 5000 molds continuously in one spray, which is 30% higher than imported products. Additionally, the burr height at the edge of the chip has been reduced from 50 μ m to below 10 μ m, resulting in a 2 percentage point increase in yield. ”The technical director of Hubei Jusheng introduced that the product has passed the AEC-Q100 automotive grade certification and can meet high-end packaging needs such as power semiconductors and AI chips.


Customer verification: SMIC mass production import reduces costs by 40%
The person in charge of SMIC's packaging and testing factory said, "Previously, we relied entirely on release agents from Japan's Shin Etsu Chemical, with a unit price of up to 120000 yuan/liter and a supply cycle of up to 6 months. JuSheng Technology's products have comparable performance, but the price is only 70000 yuan/liter, and the localized supply is stable. They have fully replaced imports in our Shanghai and Shenzhen factories." It is estimated that the annual cost savings of a single packaging line exceed 2 million yuan.


At present, Hubei Jusheng has established an annual production line of 500 tons of semiconductor grade ethyl silicone oil, and has reached cooperation intentions with packaging enterprises such as Changdian Technology and Tongfu Microelectronics. The company plans to invest 200 million yuan in the future to build a research and development center, develop semiconductor materials such as photoresist supporting solvents and high-purity electronic chemicals, and improve the industrial layout.


Policy support: Accelerated domestic substitution, broad market space
According to the White Paper on China's Semiconductor Materials Industry, the domestic semiconductor packaging material market will reach 38 billion yuan in 2023, with release agents accounting for about 5%, but the localization rate is less than 10%. With the intensification of the US technology blockade against China, independent and controllable materials have become a necessity in the industry.


Ethyl silicone oil release agent is just the starting point. We will develop 'bottleneck' materials around the entire semiconductor manufacturing process, "said the chairman of Hubei Jusheng. The company has undertaken the national 02 special sub project" Large scale Integrated Circuit Manufacturing Equipment and Complete Process ", and is expected to launch 5 high-end materials in the next 3 years to break international monopolies.


Industry perspective:
The localization of semiconductor materials is the trend. The breakthrough of JuSheng Technology proves that through collaborative innovation between industry, academia, and research, domestic enterprises are fully capable of achieving 'overtaking on the bend' in segmented fields, "said Li Ming, a professor at the School of Materials Science and Technology at Tsinghua University.