On February 3, 2026, a high thermal conductivity composite material technology based on ethyl silicone oil modification passed national level appraisal, and its thermal conductivity exceeded 8W/m · K, reaching the international advanced level. This technology was developed by a team from the School of Materials Science and Engineering, and solved the problem of balancing thermal conductivity and insulation performance of traditional silicon-based materials through nanoscale alumina filling and molecular cross-linking processes.


Technical highlight: 3D thermal conductivity network construction technology
The research team innovatively adopted a "core-shell structure" nanoparticle design, embedding alumina boron nitride composite particles into the molecular chain of ethyl silicone oil to form a three-dimensional thermal conductivity pathway. Experiments have shown that this material can reduce the temperature of core components by 12 ℃ in the heat dissipation application of 5G base station chips, while maintaining a volume resistivity of 10 Ω· cm, meeting the stringent insulation requirements of high-end electronic devices.


Industrial application: full scenario penetration from data centers to consumer electronics
At present, this technology has reached cooperation intentions with multiple leading enterprises, and the first batch of application scenarios include:


Data center: As a key medium for liquid cooling systems, it replaces traditional mineral oil to reduce pumping energy consumption by 30%;
New energy vehicles: used for thermal management of battery modules, improving fast charging efficiency and extending service life;
Wearable devices: Develop ultra-thin flexible thermal conductive patches to solve the overheating problem of micro devices such as smart watches.
Market outlook: Annual demand growth rate expected to exceed 25%
According to industry analysis agencies, with the explosion of AI computing power and the expansion of the new energy industry, the global market size of high thermal conductivity silicon-based materials will exceed 50 billion yuan by 2030. The industrialization of this technology will help China achieve a leap from "following" to "leading" in the field of electronic heat dissipation materials, and related patent clusters have been included in the key protection scope of the "National Intellectual Property Power Construction Outline".