In February 2026, a research team announced the successful development of an ultra-low temperature resistant ethyl silicone oil based thermal conductive material, which solved the heat dissipation problem of aerospace electronic equipment in extreme space environments. This material uses ethyl silicone oil as the core component and achieves stable thermal conductivity in a wide temperature range of -120 ℃ to 250 ℃ through molecular structure optimization and nanoscale additive composite technology. The thermal conductivity is increased by 40% compared to traditional materials, and it also has excellent insulation and radiation resistance.


According to the project leader, traditional aerospace electronic equipment relies on metal based thermal conductive materials for heat dissipation, but they are prone to brittleness and heavy in ultra-low temperature environments. The new ethyl silicone oil based material not only reduces its weight by 30%, but also can be directly filled into the tiny gaps of the equipment through liquid forming technology, forming a seamless thermal conductivity network. At present, the material has passed the extreme environment test of China Aerospace Science and Technology Corporation, and is planned to be carried on a certain type of satellite for in orbit verification in the third quarter of 2026. It is expected to be applied in key fields such as deep space probes and space station electronic systems in the future.


Industry analysts point out that with the integration and development of 5G communication, artificial intelligence, and aerospace technology, the requirements for heat dissipation materials in high-end electronic devices are becoming increasingly stringent. Ethyl silicone oil, with its unique molecular structure and customizable properties, is extending from the traditional industrial lubrication field to the high value-added track. This technological breakthrough may redefine the application boundary of silicone materials in cutting-edge technology.