In February 2026, with the widespread adoption of 5G communication technology, the demand for heat dissipation materials in electronic devices will experience explosive growth. In this context, a new type of thermal conductive material based on ethyl silicone oil has been successfully validated in the laboratory. Its thermal conductivity has increased by 40% compared to traditional materials, and it has excellent ultra-low temperature resistance, which can meet the operational requirements of equipment in polar environments.


Technological Breakthrough: A Leap from Laboratory to Industrialization
This material is based on ethyl silicone oil, and through molecular structure modification technology, fluorine groups are introduced into the siloxane main chain to form a unique "silicon fluorine carbon" three-dimensional network structure. This structure not only significantly improves the thermal conductivity efficiency of the material, but also maintains stable performance in the extreme temperature range of -80 ℃ to 200 ℃. Laboratory data shows that in the heat dissipation module of 5G base stations, this material can reduce the surface temperature of equipment by 12 ℃, reduce energy consumption by 8%, and effectively extend the service life of electronic components.


Application scenarios: From consumer electronics to aerospace industry
At present, the material has entered the pilot stage, and the first batch of application scenarios include:


5G base station heat dissipation: replacing traditional graphene materials to solve the high heat flux density problem of high-frequency communication equipment;
New energy vehicle battery pack: Efficient thermal management of the battery pack is achieved through liquid silicone rubber injection molding technology;
Aerospace electronic equipment: As a high thermal conductivity silicone grease component, it meets the heat dissipation needs in extreme space environments.
Industry experts point out that the breakthrough of ethyl silicone oil based thermal conductive materials marks China's transition from "following" to "running in parallel" in the field of high-end electronic materials. With the rapid development of 5G, IoT, and artificial intelligence technologies, the market size of this material is expected to exceed 5 billion yuan in the next three years.