According to the latest joint research results published by the International Journal of Advanced Materials, the scientific research team successfully prepared a new type of silicon based aerogel material with both high thermal conductivity and ultra-low dielectric constant by using ethyl silicone oil as the precursor for the first time through the in-situ crosslinking supercritical drying process, providing a new path for the thermal management problems of AI chips with a process below 3nm.
Traditional chip heat dissipation materials generally have a problem that the thermal conductivity and dielectric properties are difficult to take into account. This new aerogel derived from ethyl silicone oil can achieve a thermal conductivity of 1.8W/(m · K) while stabilizing the dielectric constant below 1.9 by adjusting the pore structure of the ethyl side chain, completely avoiding the signal delay problem in the process of high-frequency signal transmission. More importantly, the material inherits the wide temperature range characteristics of ethyl silicone oil itself, and can maintain structural stability in the full temperature range of -60 ℃ to 220 ℃, without the common thermal expansion and contraction delamination failure problems of traditional heat dissipation materials. At present, this technology has entered the verification stage of downstream wafer fabs and is expected to be widely applied in the packaging and cooling scenarios of next-generation high-performance computing chips and automotive power semiconductors in the future.