February 2, 2026- With the widespread adoption of 5G communication technology, the requirements for heat dissipation materials in electronic devices are becoming increasingly stringent. Recently, a research team announced the successful development of a nanocomposite thermal conductive material based on ethyl silicone oil, which can significantly improve the heat dissipation efficiency of 5G base stations, smartphones and other devices. This material combines ethyl silicone oil with high thermal conductivity boron nitride nanosheets, increasing the thermal conductivity to 2.3 times that of traditional materials while maintaining the original insulation properties, and maintaining stable performance in a wide temperature range of -50 ℃ to 250 ℃.


Experimental data shows that in the simulation of continuous high load operation of 5G base stations, the use of this material in the heat dissipation module can reduce the temperature of the core chip by 12 ℃ and reduce energy consumption by 8%. The team leader stated, "The low volatility and chemical inertness of ethyl silicone oil make it an ideal substrate, while nanocomposite technology further breaks through the thermal conductivity bottleneck of traditional silicon-based materials." Currently, the material has passed reliability tests by multiple leading communication companies and is expected to achieve mass production in the third quarter of 2026.


Industry analysts point out that with the acceleration of global 5G base station construction, the market for high thermal conductivity ethyl silicone oil composite materials is expected to exceed 1.5 billion yuan by 2027. Its low environmental residue characteristics also comply with the EU RoHS directive requirements, and may become the mainstream solution in the field of electronic heat dissipation.